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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MCM67D709/D
128K x 9 Bit Synchronous Dual I/O Fast Static RAM
The MCM67D709 is a 1,179,648 bit synchronous static random access memory organized as 131,072 words of 9 bits, fabricated using Motorola's high-performance silicon-gate BiCMOS technology. The device integrates a 128K x 9 SRAM core with advanced peripheral circuitry consisting of address registers, two sets of input data registers and two sets of output latches. This device has increased output drive capability supported by multiple power pins. Asynchronous inputs include the processor output enable (POE) and the system output enable (SOE). The address inputs (A0 - A16) are synchronous and are registered on the falling edge of clock (K). Write enable (W), processor input enable (PIE) and system input enable (SIE) are registered on the rising edge of clock (K). Writes to the RAM are self-timed. All data inputs/outputs, PDQ0 - PDQ7, SDQ0 - SDQ7, PDQP, and SDQP have input data registers triggered by the rising edge of the clock. These pins also have three-state output latches which are transparent during the high level of the clock and latched during the low level of the clock. This device has a special feature which allows data to be passed through the RAM between the system and processor ports in either direction. This streaming is accomplished by latching in data from one port and asynchronously output enabling the other port. It is also possible to write to the RAM while streaming. The MCM67D709's dual I/Os can be used in x9 separate I/O applications. Common I/Os PDQ0 - 7, PDQP and SDQ0 - 7, SDQP can be treated as either inputs (D) or outputs (Q) depending on the state of the control pins. In order to dedicate PDQ0 - 7, PDQP as data (D) inputs and SDQ0 - 7, SDQP as outputs (Q), tie SIE and POE high. SOE becomes the asynchronous G for the outputs. PIE will need to track W for proper write/read operations. This device is ideally suited for pipelined systems and systems with multiple data buses and multi-processing systems, where a local processor has a bus isolated from a common system bus. * * * * * * * * * * * Single 5 V 5% Power Supply 88110/88410 Compatibility: -16/60 MHz, -20/50 MHz Self-Timed Write Cycles Clock Controlled Output Latches Address and Data Input Registers Common Data Inputs and Data Outputs Dual I/O for Separate Processor and Memory Buses Separate Output Enable Controlled Three-State Outputs 3.3 V I/O Compatible High Board Density 52 Lead PLCC Package Can be used as Separate I/O x9 SRAM
MCM67D709
FN PACKAGE PLASTIC CASE 778-02
PIN ASSIGNMENTS
SIE PIE SOE POE WE K VCC VSS NC A6 A4 A2 A0 A16 A15 PDQ7 SDQ7 VSS PDQ5 SDQ5 VCC PDQ3 SDQ3 VSS PDQ1 SDQ1 7 6 5 4 3 2 1 52 51 50 49 48 47 8 46 9 45 10 44 11 43 12 42 13 41 14 40 15 39 16 38 17 37 18 36 19 35 20 34 21 22 23 24 25 26 27 28 29 30 31 32 33 A14 A13 A12 A11 A10 VSS VCC A9 A8 A7 A5 A3 A1 PDQP SDQP VSS PDQ6 SDQ6 VCC PDQ4 SDQ4 PDQ2 SDQ2 VSS PDQ0 SDQ0
PIN NAMES
A0 - A16 . . . . . . . . . . . . . . . Address Inputs K . . . . . . . . . . . . . . . . . . . . . . . . . Clock Input W . . . . . . . . . . . . . . . . . . . . . . . Write Enable PIE . . . . . . . . . . . . . Processor Input Enable SIE . . . . . . . . . . . . . . . System Input Enable POE . . . . . . . . . . Processor Output Enable SOE . . . . . . . . . . . . . System Output Enable PDQ0 - PDQ7 . . . . . . . Processor Data I/O PDQP . . . . . . . . . . . Processor Data Parity SDQ0 - SDQ7 . . . . . . . . . System Data I/O SDQP . . . . . . . . . . . . . System Data Parity VCC . . . . . . . . . . . . . . . + 5 V Power Supply VSS . . . . . . . . . . . . . . . . . . . . . . . . . . Ground NC . . . . . . . . . . . . . . . . . . . . No Connection All power supply and ground pins must be connected for proper operation of the device.
REV2 5/95
(c) Motorola, Inc. 1994 MOTOROLA FAST SRAM
MCM67D709 1
BLOCK DIAGRAM
PDQ0 - PDQ7, PDQP POE
9 K DATA REGISTER A0 - A16 128K x 9 ARRAY REGISTER WRITE DRIVER DATA LATCH CONTROL DATA REGISTER SOE SDQ0 - SDQ7, SDQP Output High-Z Data Out Data Out High-Z High-Z High-Z Data In Stream Data Data In Stream Data Data In High-Z Stream High-Z Data In Data In 2, 4 2, 5 2, 5 2, 6 2, 6 2, 6 2, 6 4 2, 7 2, 7 2, 7 2, 7
9
SENSE AMPLIFIER
DATA LATCH
W PIE SIE
9 SDQ0 - SDQ7, SDQP
FUNCTIONAL TRUTH TABLE (See Notes 1 and 2)
W 1 1 1 1 X 0 0 0 0 1 1 0 X X X X PIE 1 1 1 X 0 0 1 0 1 0 1 1 0 0 1 1 SIE 1 1 1 X 0 1 0 1 0 1 0 1 1 1 0 0 POE 0 1 0 1 X 1 1 1 0 1 0 X 0 0 0 1 SOE 1 0 0 1 X 1 1 0 1 0 1 X 0 1 0 0 Mode Read Read Read Read N/A Write Write Write Write N/A N/A N/A N/A N/A N/A N/A Memory Subsystem Cycle Processor Read Copy Back Dual Bus Read NOP NOP Processor Write Hit Allocate Write Through Allocate With Stream Cache Inhibit Write Cache Inhibit Read NOP Invalid Invalid Invalid Invalid PDQ0 - PDQ7, PDQP Output Data Out High-Z Data Out High-Z High-Z Data In High-Z Data In Stream Data Data In Stream Data High-Z Data In Data In Stream High-Z Notes 3 3 3
NOTES: 1. A `0' represents an input voltage VIL and a `1' represents an input voltage VIH. All inputs must satisfy the specified setup and hold times for the falling or rising edge of K. Some entries in this truth table represent latched values. Other possible combinations of control inputs not covered by this note or the table above are not supported and the RAMs behavior is not specified. 2. If either IE signal is sampled low on the rising edge of clock, the corresponding OE is a don't care, and the corresponding outputs are High-Z. 3. A read cycle is defined as a cycle where data is driven on the internal data bus by the RAM. 4. No RAM cycle is performed. 5. A write cycle is defined as a cycle where data is driven onto the internal data bus through one of the data I/O ports (PDQ0 - PDQ7 and PDQP or SDQ0 - SDQ7 and SPDQ), and written into the RAM. 6. Data is driven on the internal data bus by one I/O port through its data input register and latched into the data output latch of the other I/O port. 7. Data contention will occur.
MCM67D709 2
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS = 0 V)
Rating Power Supply Voltage Relative to VSS for Any Pin Except VCC Output Current (per I/O) Power Dissipation Temperature Under Bias Operating Temperature Storage Temperature Symbol VCC Vin, Vout Iout PD Tbias TA Value - 0.5 to + 7.0 - 0.5 to VCC + 0.5 30 2.0 - 10 to + 85 0 to +70 Unit V V mA W C C This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high-impedance circuit.
Tstg - 55 to + 125 C NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
DC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V 5%, TA = 0 to + 70C, Unless Otherwise Noted) RECOMMENDED OPERATING CONDITIONS AND SUPPLY CURRENTS (Voltages referenced to VSS = 0 V)
Parameter Supply Voltage (Operating Voltage Range) Input High Voltage Input Low Voltage Input Leakage Current (All Inputs, Vin = 0 to VCC) Output Leakage Current (POE, SOE = VIH) AC Supply Current (All Inputs = VIL or VIH,VIL = 0.0 V and VIH 3.0 V, Iout = 0 mA, Cycle Time tKHKH min) MCM67D709-16: tKHKH = 16 ns MCM67D709-20: tKHKH = 20 ns Output Low Voltage (IOL = + 8.0 mA) Output High Voltage (IOH = - 4.0 mA) Symbol VCC VIH VIL Ilkg(I) Ilkg(O) ICCA -- -- VOL VOH -- 2.4 280 260 0.4 3.3 V V Min 4.75 2.2 - 0.5* -- -- Max 5.25 VCC + 0.3** 0.8 1.0 1.0 Unit V V V A A mA
* VIL (min) = - 0.5 V dc; VIL (min) = - 2.0 V ac (pulse width 20 ns) for I 20.0 mA. ** VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2.0 V ac (pulse width 20 ns) for I 20.0 mA.
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, TA = 25C, Periodically Sampled Rather Than 100% Tested)
Parameter Input Capacitance (All Pins Except I/Os) Input/Output Capacitance (PDQ0 - PDQ7, SDQ0 - SDQ7, PDQP, SDQP) Symbol Cin Cout Typ 5 6 Max 6 7 Unit pF pF
MOTOROLA FAST SRAM
MCM67D709 3
AC OPERATING CONDITIONS AND CHARACTERISTICS
(VCC = 5.0 V 5%, TA = 0 to + 70C, Unless Otherwise Noted)
Input Timing Measurement Reference Level . . . . . . . . . . . . . . . 1.5 V Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to 3.0 V Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ns Output Measurement Timing Level . . . . . . . . . . . . . . . . . . . . . . . 1.5 V Output Load . . . . . . . . . . . . See Figure 1A Unless Otherwise Noted
READ CYCLE (See Note 1)
Processor Frequency 60 MHz MCM67D709-16 Parameter Read Cycle Time Clock High to Clock High Clock Low Pulse Width Clock High Pulse Width Clock High to Output Valid Clock (K) High to Output Low Z After Write Output Hold from Clock High Setup Times: A W PIE SIE A W PIE SIE Symbol tKHKH tKLKH tKHKL tKHQV tKHQX1 tKHQX2 tAVKL tWHKH tPIEHKH tSIEHKH tKLAX tKHWX tKHPIEX tKHSIEX tPOEHQZ tSOEHQZ tPOEHQX tSOEHQX tPOELQX tSOELQX tPOELQV tSOELQV Min 16 5 7 -- 0 2 2 2 2 2 2 2 2 2 0 2 0 -- Max -- -- -- 6 -- -- -- 50 MHz MCM67D709-20 Min 20 5 7 -- 0 3 2 2 2 2 2 2 2 2 0 5 0 -- Max -- -- -- 7.5 -- -- -- Unit ns ns ns ns ns ns ns 3, 4 3 Notes 1, 2
Hold Times:
--
--
ns
Output Enable High to Q High-Z Output Hold from Output Enable High Output Enable Low to Q Active Output Enable Low to Output Valid
6 -- -- 5
8 -- -- 6
ns ns ns ns
4 4 4
NOTES: 1. A read is defined by W high for the setup and hold times. 2. All read cycle timing is referenced from K, SOE, or POE. 3. K must be at a high level for outputs to transition. 4. Transition is measured 500 mV from steady-state voltage with output load of Figure 1B. This parameter is sampled and not 100% tested. At any given voltage and temperature, tPOEHQZ is less than tPOELQX for a given device, and tSOEHQZ is less than tSOELQX for a given device.
AC SPEC LOADS
+5V RL = 50 OUTPUT Z0 = 50 VL = 1.5 V OUTPUT 255 5 pF 480
Figure 1A
Figure 1B
MCM67D709 4
MOTOROLA FAST SRAM
READ CYCLE (See Note)
tKHKH tKLKH K tKLAX tAVKL A0 - A16 An tKHPIEX tPIEHKH PIE tKHSIEX tSIEHKH An + 1 An + 2 tKHKL
SIE tKHWX tWHKH W
POE tPOELQV tPOELQX SOE tPOEHQZ tPOEHQX tSOELQV PDQ0 - PDQ7, PDQP tKHQV SDQ0 - SDQ7, SDQP Qn tKHQX2 Qn + 1 Qn tKHQX1
MOTOROLA FAST SRAM
MCM67D709 5
WRITE THROUGH - READ - WRITE (See Note 1)
Processor Frequency 60 MHz MCM67D709-16 Parameter Write Cycle Times Clock Low Pulse Width Clock High Pulse Width Clock High to Output High-Z (W = VIL and SIE = PIE = VIH) Setup Times: A W PIE SIE SDQ0 - SDQ7, SDQP, PDQ0 - PDQ7, PDQP A W PIE SIE SDQ0 - SDQ7, SDQP, PDQ0 - PDQ7, PDQP Symbol tKHKH tKLKH tKHKL tKHQZ tAVKL tWLKH tPIEVKH tSIEVKH tDVKH tKLAX tKHWX tKHPIEX tKHSIEX tKHDX tKHQV tPOEHQZ tSOEHQZ tPOEHQX tSOEHQX tPOELQX tSOELQX tPOELQV tSOELQV Min 16 5 7 -- 2 2 2 2 2 2 2 2 2 2 -- 0 2 0 -- Max -- -- -- 8 -- 50 MHz MCM67D709-20 Min 20 5 7 -- 2 2 2 2 2 2 2 2 2 2 -- 0 5 0 -- Max -- -- -- 8 -- Unit ns ns ns ns ns 3, 4 Notes 1, 2
Hold Times:
--
--
ns
Write with Streaming (PIE = SOE = VIL or SIE = POE = VIL) Clock High to Output Valid Output Enable High to Q High-Z Output Hold from Output Enable High Output Enable Low to Q Active Output Enable Low to Output Valid
5 6 -- -- 5
7 8 -- -- 6
ns ns ns ns ns
5 6 6 6
NOTES: 1. A write is performed with W = VIL for the specified setup and hold times and either PIE = VIL or SIE = VIL. If both PIE = VIL and SIE = VIL or PIE = VIH and SIE = VIH, then this is treated like a NOP and no write is performed. 2. All write cycle timings are referenced from K. 3. K must be at a high level for the outputs to transition. 4. Transition is measured 500 mV from steady-state voltage with output load of Figure 1B. This parameter is sampled and not 100% tested. 5. A write with streaming is defined as a write cycle which writes data from one data bus to the array and outputs the same data onto the other data bus. 6. Transition is measured 500 mV from steady-state voltage with output load of Figure 1B. This parameter is sampled and not 100% tested. At any given voltage and temperature, tPOEHQZ is less than tPOELQX for a given device, and tSOEHQZ is less than tSOELQX for a given device.
MCM67D709 6
MOTOROLA FAST SRAM
WRITE THROUGH -- READ -- WRITE
tKHKH tKLKH K tKLAX tAVKL A0 - A16 An tKHPIEX tPIEVKH PIE tKHSIEX tSIEVKH SIE tKHWX tWLKH W tWHKH tKHWX tSIEHKH tKHSIEX An + 1 An + 2 tPIEHKH tKHPIEX tKHKL
POE tPOEHQZ SOE tDVKH tKHDX tSOELQV PDQ0 - PDQ7, PDQP Qn - 1 Dn tKHQV SDQ0 - SDQ7, SDQP Qn - 1 Qn (STREAMED) tPOEHQX tSOEHQZ tPOELQV tSOEHQX Qn +1 tPOELQX tKHDX tPOEHQZ tDVKH Dn + 2
MOTOROLA FAST SRAM
MCM67D709 7
STREAM CYCLE (See Note 1)
Processor Frequency 60 MHz MCM67D709-16 Parameter Stream Cycle Time Clock Low Pulse Width Clock High Pulse Width Stream Access Time Setup Times: A W PIE SIE SDQ0 - SDQ7, SDQP, PDQ0 - PDQ7, PDQP A W PIE SIE SDQ0 - SDQ7, SDQP, PDQ0 - PDQ7, PDQP Symbol tKHKH tKLKH tKHKL tKHQV tAVKL tWHKH tPIEVKH tSIEVKH tDVKH tKLAX tKHWX tKHPIEX tKHSIEX tKHDX tPOEHQZ tSOEHQZ tPOELQX tSOELQX tPOELQV tSOELQV Min 16 5 7 -- 2 2 2 2 2 2 2 2 2 2 0 0 -- Max -- -- -- 6 -- 50 MHz MCM67D709-20 Min 20 5 7 -- 2 2 2 2 2 2 2 2 2 2 0 0 -- Max -- -- -- 7 -- Unit ns ns ns ns ns Notes 1, 2
Hold Times:
--
--
ns
Output Enable High to Q High-Z Output Enable Low to Q Active Output Enable Low to Output Valid
6 -- 5
8 -- 6
ns ns ns
3 3
NOTES: 1. A stream cycle is defined as a cycle where data is passed from one data bus to the other data bus. 2. All stream cycle timing is referenced from K. 3. Transition is measured 500 mV from steady-state voltage with output load of Figure 1B. This parameter is sampled and not 100% tested. At any given voltage and temperature, tPOEHQZ is less than tPOELQX, tSOEHQZ is less than tSOELQX, for a given device.
MCM67D709 8
MOTOROLA FAST SRAM
STREAM CYCLE
tKHKH tKLKH K tKLAX tAVKL A0 - A16 An tKHPIEX An + 1 tPIEVKH An + 2 tKHKL
PIE tKHSIEX tSIEVKH
SIE tKHWX tWHKH W
POE tPOEHQZ SOE tDVKH PDQ0 - PDQ7, PDQP Qn - 1 Dn tKHQV SDQ0 - SDQ7, SDQP Qn - 1 Qn (STREAMED) Dn + 1 tSOEHQZ tKHDX tKHQV Qn + 1 (STREAMED)
MOTOROLA FAST SRAM
MCM67D709 9
ORDERING INFORMATION
(Order by Full Part Number) MCM
Motorola Memory Prefix Part Number Package (FN = PLCC) Full Part Numbers -- MCM67D709FN16 MCM67D709FN20
67D709
FN
XX
Speed (16 = 16 ns (60 MHz), 20 = 20 ns (50 MHz))
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
MCM67D709 10
MOTOROLA FAST SRAM
PACKAGE DIMENSIONS
FN PACKAGE 52-LEAD PLCC CASE 778-02
B -NY BRK D -L52 LEADS ACTUAL -MW D V A Z R 0.007 (0.180)
M
0.007 (0.180) U
M
T L -M
M
S
N
S
0.007 (0.180)
T L -M
S
N
S
Z
(NOTE 1) 52
1
X VIEW D-D 0.007 (0.180)
M
G1 0.010 (0.250)
S
T L -M
S
N
S
T L -M
S
N
S
T L -M
S
N
S
H
0.007 (0.180)
M
T L -M
S
N
S
C
(NOTE 1) 52
E 0.004 (0.100) G G1 0.010 (0.250)
S
K1 K F VIEW S 0.007 (0.180)
M
J
-T-
SEATING PLANE
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DUE TO SPACE LIMITATION, CASE 778-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE DRAWING RATHER THAN SHOWING ALL 52 LEADS. 2. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 3. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 4. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 5. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 6. CONTROLLING DIMENSION: INCH. 7. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 8. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.785 0.795 0.785 0.795 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 -- 0.020 -- 0.025 0.750 0.756 0.750 0.756 0.042 0.048 0.042 0.048 0.042 0.056 0.020 -- 10 2 0.710 0.730 0.040 --
MILLIMETERS MIN MAX 19.94 20.19 19.94 20.19 4.20 4.57 2.79 2.29 0.48 0.33 1.27 BSC 0.81 0.66 -- 0.51 -- 0.64 19.05 19.20 19.05 19.20 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 10 2 18.04 18.54 1.02 --
MOTOROLA FAST SRAM
MCM67D709 11
Literature Distribution Centers: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. JAPAN: Nippon Motorola Ltd.; 4-32-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong.
MCM67D709 12
CODELINE TO BE PLACED HERE
*MCM67D709/D*
MCM67D709/D MOTOROLA FAST SRAM


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